Scaling in MEMS

MICRO-606

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Course summary

This doctoral class covers the scaling of MEMS devices, including mechanical, thermal, electrostatic, and microfluidic aspects.

Topics

  • Introduction to scaling laws: scaling of classical mechanical systems, scaling of classical electrical systems, breakdown in scaling, quantum breakdown.
  • Mechanical scaling: mass-spring model, mechanical noise, squeeze film effects.
  • Thermal scaling: conduction, convection, dynamics, breakdown, thermal micro-actuators.
  • Microfluidic scaling: liquid flow, gas flow, diffusion-mixing, surface tension,
  • Electrostatic scaling: parallel plate actuators, zipping actuators, electrostatic breakdown
  • Piezo-scaling
Please note: Attendance to all four days is mandatory

Grading:
Students will make a presentation analyzing how scaling laws influence the design, performance, and limitations of one specific MEMS device.

you will:
- Learn how scaling-related effects differ in different physical domains
- be able establish simple scaling rules
- understand examples where scaling effects are exploited
- Be able to select an appropriate actuation/sensing principle adapted to your size scale and application


Intro


Mechanical scaling


Electrostatic scaling


Thermal scaling


Fluidic scaling


Piezos