Microfabrication technologies

MICRO-331

Question for SLT#2

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Description

Here are the 6 questions to prepare for the SLTl#2 session scheduled for next week. They are related to the topic Lithography.

Please prepare the possible answers by consulting the MOOC and any other public available source. Each of you may be asked to present your solution path in your respective group. If you have questions, please send first your thoughts on ED stem.

2.1       What are the steps to fabricate a Cr mask for photolithography? How is that type of mask used to transfer patterns to a wafer?

2.2       Pattern transfer can be done by etching or lift-off. Make a step-by-step schematic process flow of both strategies and explain their key differences

2.3       What are the different types of light sources used for exposure? How does the resolution of a lithographic process depend on the wavelength of light used?

2.4       What information can you extract from the resist spin curve? Give an example. What other methods to coat substrates with photoresists exist?

2.5       Explain the photoresist contrast curve and the meaning of exposure dose. Describe how to reach a given resist sidewall profile.

2.6       What is the working principle of EBL (Electron Beam Lithography)? What are the advantages and limitations of this technique?


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